Sputtering coating refers to the technology that the ions produced by the ion source are accelerated to gather in the vacuum to form a high speed ion beam, which bombards the solid surface, and the kinetic energy exchange between the ions and the solid surface atoms makes the atoms on the solid surface leave the solid and deposit on the surface of the substrate material. The bombarded solid is the raw material for deposition of thin film materials by sputtering method, which is called the sputtering target.

Sputtering targets have important applications in many industries. Purity is one of the key performance indicators for producing a suitable coating, the purity of the sputter coater target greatly affects the performance of the film.

Through independent R&D and cooperative development, we have the technical ability to produce ultra-high purity sputtering target metal materials. Previously, Acetron target with a purity reached 99.9999 %, was able to meet the process requirements of the electronics industry.

The uniformity and sputtering velocity of the sputtering films are determined by the size, orientation and orientation of the grains. Therefore, the control of grain size and grain direction are the core technologies in the production process of sputtering target material. We have the metal material plastic deformation processing production line and internal tissue structure testing equipment, through scientific process arrangement, can implement precise control of grain crystal direction.