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Metal Sputtering Targets

Metal Sputtering Targets

Metal sputtering targets are materials extensively utilized in modern industry. They are primarily employed in the sputtering process for thin film deposition across various industries, including semiconductor, electronics, optics, and surface coating. It is a method of transforming a solid material into a liquid or gaseous state and accelerating it to the target surface using physical vapor deposition techniques. It uses ions produced by an ion source to gather at an accelerated rate in a vacuum, forming a high- speed ion beam that bombards a solid surface. The ions exchange kinetic energy with the solid surface atoms, causing the solid surface atoms to leave the solid and deposit on the base surface.

Acetron metal targets are engineered to withstand the high-energy bombardment during the sputtering process and maintain stable performance over extended deposition cycles. The application range of sputtering target covers many fields such as electronics, optics, chemistry, automobile, aerospace, medicine and so on. Questions? Need Help?


Metal sputtering targets are composed of high-purity metals or metal alloys tailored to specific applications. Common metals used as sputtering targets include gold (Au), silver (Ag), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), and platinum (Pt), among others. These targets may also be composed of alloy combinations to achieve desired film properties.

Production Process

Metal sputtering targets are manufactured using various techniques such as powder metallurgy, hot pressing, cold isostatic pressing, and vacuum melting. The goal is to produce targets with high density, uniform microstructure, and minimal impurities to ensure consistent sputtering performance.


Sputtering targets can be classified based on the type of material, such as pure metal targets, alloy targets, and composite targets. Additionally, they can vary in shape and size, including planar targets (flat discs), rotary targets (cylindrical), and custom-shaped targets tailored to specific coating requirements.


Metal sputtering targets are used in a wide range of applications, including semiconductor device fabrication (integrated circuits, thin film transistors), optical coatings (antireflective coatings, reflective mirrors), magnetic storage media (hard disk drives), solar cells, wear-resistant coatings, and decorative finishes.


The properties of metal sputtering targets, such as purity, density, grain size, and surface finish, play a crucial role in determining the quality and performance of the deposited thin films. High-purity targets with minimal impurities ensure uniform film deposition and improved film properties.

Metal sputtering targets are essential materials in thin film deposition processes, offering precise control over film composition, thickness, and properties for a wide range of industrial applications.

  • Planar Metal Sputtering Targets

    The plane target material is connected with sputtering equipment by means of thread, the sputtering film layer is attached to the substrate under vacuum conditions, and then the film is processed by various methods to meet different needs.

  • Rotary Metal Sputtering Targets

    A rotary sputter target is a magnetically controlled component shaped like a cylinder with an embedded stationary magnet for rotation. Its key advantage lies in its high utilization rate, albeit at a higher cost.

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