Sputtering Target
Acetron is a trusted manufacturer and global supplier of high-purity sputtering targets used in a wide range of physical vapor deposition (PVD) processes. We provide metal, alloy, and ceramic sputtering targets designed for consistent thin film performance across semiconductor, optical, photovoltaic, and decorative coating applications.
Our sputtering targets are produced with ultra-high purity materials (up to 99.999%), dense microstructures, and advanced bonding techniques to ensure optimal film quality, uniformity, and target utilization. Whether you need standard compositions or fully customized specifications, Acetron delivers precision-engineered targets tailored to your process requirements.
Metal Sputtering Target: Single-element targets such as copper (Cu), aluminum (Al), titanium (Ti), molybdenum (Mo), etc.
Alloy Sputtering Target: Engineered compositions including TiAl, NiCr, AgCu, and more.
Ceramic Sputtering Target: Oxide, nitride, carbide, and fluoride targets such as ITO, ZnO, Al₂O₃, and TiN.
High Purity (up to 5N or 6N)
Low Oxygen and Carbon Impurities
Uniform Grain Structure and Density
Strong Bonding for Stable Operation
Custom Sizes, Shapes, and Compositions Available
Our sputtering targets are widely used in:
Semiconductor and microelectronics (ICs, MEMS, sensors)
Optical coatings (AR/IR coatings, beam splitters, filters)
Solar energy and photovoltaic modules (CIGS, CdTe, ITO films)
Data storage (hard disks, magnetic layers)
Decorative and wear-resistant coatings (tooling, watches, hardware)
At Acetron, we understand that every coating process is different. That’s why we offer:
Custom compositions and material formulations
Target size and shape customization (rotatable, planar, circular, rectangular)
Bonding to backing plates (Cu, Mo, Al, etc.)
Small batch production for R&D or pilot runs
Bulk production for OEM and industrial-scale applications
The uniformity and sputtering velocity of the sputtering films are determined by the size, orientation and orientation of the grains. Therefore, the control of grain size and grain direction are the core technologies in the production process of sputtering target material. We have the metal material plastic deformation processing production line and internal tissue structure testing equipment, through scientific process arrangement, can implement precise control of grain crystal direction. Get in touch with us today to discuss your needs!
Rotary Metal Sputtering Targets
A rotary sputter target is a magnetically controlled component shaped like a cylinder with an embedded stationary magnet for rotation. Its key advantage lies in its high utilization rate, albeit at a higher cost.
Rotary Alloy Sputtering Target
Excellent properties such as high purity, high density, Good composition uniformity, Uniform grain, etc.
Planar Ceramic Sputtering Target
Excellent properties such as high purity, high density,Good microstructure uniformity, excellent electrical properties.
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Product classification
Core competencies
Brand advantage
Strategic advantage
R & D and talent stock advantage
Supply chain advantage